Technology
Technology
Applied
Applied

Technology

Technology

Current

Mid-Term

Long-Term

Line Width/Space-Phototool
.003
<.003
<.003
Line Width/Space-Laser Direct Imaging (LDI)
.002
.002
.002
Plated Hole Diameter Finished
.005
.005
.004
Pad Diameter
.016
.012
.010
Drill Size – Mechanical
.006
.006
.006
Drill Size – Laser
.004
.0035
.003
Plane Clearance + Drill Size
.018
.016
.014
Maximum Aspect Ratio
12:1
14:1
16:1
Maximum Number Layers
32
40
40+
Minimum Core Thickness
.0025
.0025
.002
Maximum Panel Size
21 x 24
21 x 24
21 x 24
Maximum Board Thickness
.200
.250
.250
BGA Pitch
0.4mm
0.4 mm
0.4 mm
Blind/Buried Via-Mechanical Drill / Sequential
Yes
Yes
Yes
Via Filling and Planarization –Cap Plating (IPC-4761)
Yes
Yes
Yes
Micro-Via-Laser Drill to Capture Pad
Yes
Yes
Yes

Tolerance

Current

Mid-Term

Long-Term

Layer-to-Layer Registration
+/- .003
+/- .003
+/- .0025
Warpage
.50%
.50%
.50%
Board Thickness
+/- 10%
+/- 7%
+/- 5%
Trace Width (Half Ounce Copper)
+/- .001
+/- .0007
+/- .0005
Impedance
+/- 10%
+/- 7%
+/- 5%
Hole Location
+/- .003
+/- .003
+/- .003

Standard Materials

Current

Mid-Term

Long-Term

FR-4 140-150Tg / High Temp 170Tg
Yes
Yes
Yes
RoHS / Lead-Free Tg180/ Td340  Yes  Yes  Yes
Isola 370HR/ Panasonic 1755V/ Ventec VT-47/ ITEQ 158/180A
Yes
Yes
Yes
Polyimide
Yes
Yes
Yes
BT Epoxy
Yes
Yes
Yes
Aluminum & Copper backed materials
Yes
Yes Yes
Metal “Coins”
Yes
Yes Yes
Flexible Circuit Materials
Yes
Yes
Yes

High Frequency Materials

Current

Mid-Term

Long-Term

Isola FR-408/IS415/IS620
Yes
Yes
Yes
Megtron6
Yes
Yes
Yes
Rogers 4000,6000, 5000 series
Yes
Yes
Yes
Arlon 25 series
Yes
Yes
Yes
Teflon
Yes
Yes
Yes

HDI Materials

Current

Mid-Term

Long-Term

RCC (Resin Coated Copper Foil)
No
Yes
Yes
Other: Lead-Free, CAF, Halogen-Free
Yes
Yes
Yes

Surface Finishes (Thickness)

Current

Mid-Term

Long-Term

Immersion Gold ( RoHS/Lead-Free)
3-5 u inch
3-5 u inch
3-5 u inch
Immersion Tin  ( RoHS/Lead-Free)
30-60 u inch
30-60 u inch
30-60 u inch
Immersion Silver  ( RoHS/Lead-Free)
8-14 u inch
8-14 u inch
8-14 u inch
Lead Free HASL  ( RoHS/Lead-Free)
.0001 – .00015
.0001 – .00015
N/A
Hot-Air-Solder-Level (HASL)
.0001 – .00015
.0001 – .00015
N/A
Electrolytic Soft Gold
30 u inch
30 u inch
30 u inch
Electrolytic Hard Gold
50 u inch
50 u inch
50 u inch
Gold Tabs
30-50 u inch
30-50 u inch
30-50 u inch

Soldermask

Current

Mid-Term

Long-Term

Minimum Web (Dam)
.003
.002
.002
Via Plug – Secondary Screen
Yes
Yes
Yes
Soldermask defined features Yes Yes Yes

Electrical Test

Current

Mid-Term

Long-Term

Universal Grid- SMT Dual Sided
.015 Pitch
.015 Pitch
.012 Pitch
Flying Probe
.006 Pitch
.006 Pitch
.004 Pitch
Non-Contact Tester
N/A
N/A
Yes

HDI

Current

Mid-Term

Long-Term

Sequential Lamination- Mechanical Drill
.006
.006
.006
Laser Ablation- Drill Diameter
.004
.004
.003
Laser Ablation- Capture Pad Diameter
.012
.010
.010
VIA-In-Pad
Yes
Yes
Yes