Technology
Technology |
Current |
Mid-Term |
Long-Term |
Line Width/Space-Phototool |
.003
|
<.003
|
<.003
|
Line Width/Space-Laser Direct Imaging (LDI) |
.002
|
.002
|
.002
|
Plated Hole Diameter Finished |
.005
|
.005
|
.004
|
Pad Diameter |
.016
|
.012
|
.010
|
Drill Size – Mechanical |
.006
|
.006
|
.006
|
Drill Size – Laser |
.004
|
.0035
|
.003
|
Plane Clearance + Drill Size |
.018
|
.016
|
.014
|
Maximum Aspect Ratio |
12:1
|
14:1
|
16:1
|
Maximum Number Layers |
32
|
40
|
40+
|
Minimum Core Thickness |
.0025
|
.0025
|
.002
|
Maximum Panel Size |
21 x 24
|
21 x 24
|
21 x 24
|
Maximum Board Thickness |
.200
|
.250
|
.250
|
BGA Pitch |
0.4mm
|
0.4 mm
|
0.4 mm
|
Blind/Buried Via-Mechanical Drill / Sequential |
Yes
|
Yes
|
Yes
|
Via Filling and Planarization –Cap Plating (IPC-4761) |
Yes
|
Yes
|
Yes
|
Micro-Via-Laser Drill to Capture Pad |
Yes
|
Yes
|
Yes
|
Tolerance |
Current |
Mid-Term |
Long-Term |
Layer-to-Layer Registration |
+/- .003
|
+/- .003
|
+/- .0025
|
Warpage |
.50%
|
.50%
|
.50%
|
Board Thickness |
+/- 10%
|
+/- 7%
|
+/- 5%
|
Trace Width (Half Ounce Copper) |
+/- .001
|
+/- .0007
|
+/- .0005
|
Impedance |
+/- 10%
|
+/- 7%
|
+/- 5%
|
Hole Location |
+/- .003
|
+/- .003
|
+/- .003
|
Standard Materials |
Current |
Mid-Term |
Long-Term |
FR-4 140-150Tg / High Temp 170Tg |
Yes
|
Yes
|
Yes
|
RoHS / Lead-Free Tg180/ Td340 | Yes | Yes | Yes |
Isola 370HR/ Panasonic 1755V/ Ventec VT-47/ ITEQ 158/180A |
Yes
|
Yes
|
Yes
|
Polyimide |
Yes
|
Yes
|
Yes
|
BT Epoxy |
Yes
|
Yes
|
Yes |
Aluminum & Copper backed materials |
Yes
|
Yes | Yes |
Metal “Coins” |
Yes
|
Yes | Yes |
Flexible Circuit Materials |
Yes
|
Yes
|
Yes
|
High Frequency Materials |
Current |
Mid-Term |
Long-Term |
Isola FR-408/IS415/IS620 |
Yes
|
Yes
|
Yes
|
Megtron6 |
Yes
|
Yes
|
Yes
|
Rogers 4000,6000, 5000 series |
Yes
|
Yes
|
Yes
|
Arlon 25 series |
Yes
|
Yes
|
Yes
|
Teflon |
Yes
|
Yes
|
Yes
|
HDI Materials |
Current |
Mid-Term |
Long-Term |
RCC (Resin Coated Copper Foil) |
No
|
Yes
|
Yes
|
Other: Lead-Free, CAF, Halogen-Free |
Yes
|
Yes
|
Yes
|
Surface Finishes (Thickness) |
Current |
Mid-Term |
Long-Term |
Immersion Gold ( RoHS/Lead-Free) |
3-5 u inch
|
3-5 u inch
|
3-5 u inch
|
Immersion Tin ( RoHS/Lead-Free) |
30-60 u inch
|
30-60 u inch
|
30-60 u inch
|
Immersion Silver ( RoHS/Lead-Free) |
8-14 u inch
|
8-14 u inch
|
8-14 u inch
|
Lead Free HASL ( RoHS/Lead-Free) |
.0001 – .00015
|
.0001 – .00015
|
N/A
|
Hot-Air-Solder-Level (HASL) |
.0001 – .00015
|
.0001 – .00015
|
N/A
|
Electrolytic Soft Gold |
30 u inch
|
30 u inch
|
30 u inch
|
Electrolytic Hard Gold |
50 u inch
|
50 u inch
|
50 u inch
|
Gold Tabs |
30-50 u inch
|
30-50 u inch
|
30-50 u inch
|
Soldermask |
Current |
Mid-Term |
Long-Term |
Minimum Web (Dam) |
.003
|
.002
|
.002
|
Via Plug – Secondary Screen |
Yes
|
Yes
|
Yes
|
Soldermask defined features | Yes | Yes | Yes |
Electrical Test |
Current |
Mid-Term |
Long-Term |
Universal Grid- SMT Dual Sided |
.015 Pitch
|
.015 Pitch
|
.012 Pitch
|
Flying Probe |
.006 Pitch
|
.006 Pitch
|
.004 Pitch
|
Non-Contact Tester |
N/A
|
N/A
|
Yes
|
HDI |
Current |
Mid-Term |
Long-Term |
Sequential Lamination- Mechanical Drill |
.006
|
.006
|
.006
|
Laser Ablation- Drill Diameter |
.004
|
.004
|
.003
|
Laser Ablation- Capture Pad Diameter |
.012
|
.010
|
.010
|
VIA-In-Pad |
Yes
|
Yes
|
Yes
|