Technology
Technology |
Current |
Mid-Term |
Long-Term |
| Line Width/Space-Phototool |
.003
|
<.003
|
<.003
|
| Line Width/Space-Laser Direct Imaging (LDI) |
.002
|
.002
|
.002
|
| Plated Hole Diameter Finished |
.005
|
.005
|
.004
|
| Pad Diameter |
.016
|
.012
|
.010
|
| Drill Size – Mechanical |
.006
|
.006
|
.006
|
| Drill Size – Laser |
.004
|
.0035
|
.003
|
| Plane Clearance + Drill Size |
.018
|
.016
|
.014
|
| Maximum Aspect Ratio |
12:1
|
14:1
|
16:1
|
| Maximum Number Layers |
32
|
40
|
40+
|
| Minimum Core Thickness |
.0025
|
.0025
|
.002
|
| Maximum Panel Size |
21 x 24
|
21 x 24
|
21 x 24
|
| Maximum Board Thickness |
.200
|
.250
|
.250
|
| BGA Pitch |
0.4mm
|
0.4 mm
|
0.4 mm
|
| Blind/Buried Via-Mechanical Drill / Sequential |
Yes
|
Yes
|
Yes
|
| Via Filling and Planarization –Cap Plating (IPC-4761) |
Yes
|
Yes
|
Yes
|
| Micro-Via-Laser Drill to Capture Pad |
Yes
|
Yes
|
Yes
|
Tolerance |
Current |
Mid-Term |
Long-Term |
| Layer-to-Layer Registration |
+/- .003
|
+/- .003
|
+/- .0025
|
| Warpage |
.50%
|
.50%
|
.50%
|
| Board Thickness |
+/- 10%
|
+/- 7%
|
+/- 5%
|
| Trace Width (Half Ounce Copper) |
+/- .001
|
+/- .0007
|
+/- .0005
|
| Impedance |
+/- 10%
|
+/- 7%
|
+/- 5%
|
| Hole Location |
+/- .003
|
+/- .003
|
+/- .003
|
Standard Materials |
Current |
Mid-Term |
Long-Term |
| FR-4 140-150Tg / High Temp 170Tg |
Yes
|
Yes
|
Yes
|
| RoHS / Lead-Free Tg180/ Td340 | Yes | Yes | Yes |
| Isola 370HR/ Panasonic 1755V/ Ventec VT-47/ ITEQ 158/180A |
Yes
|
Yes
|
Yes
|
| Polyimide |
Yes
|
Yes
|
Yes
|
| BT Epoxy |
Yes
|
Yes
|
Yes |
| Aluminum & Copper backed materials |
Yes
|
Yes | Yes |
| Metal “Coins” |
Yes
|
Yes | Yes |
| Flexible Circuit Materials |
Yes
|
Yes
|
Yes
|
High Frequency Materials |
Current |
Mid-Term |
Long-Term |
| Isola FR-408/IS415/IS620 |
Yes
|
Yes
|
Yes
|
| Megtron6 |
Yes
|
Yes
|
Yes
|
| Rogers 4000,6000, 5000 series |
Yes
|
Yes
|
Yes
|
| Arlon 25 series |
Yes
|
Yes
|
Yes
|
| Teflon |
Yes
|
Yes
|
Yes
|
HDI Materials |
Current |
Mid-Term |
Long-Term |
| RCC (Resin Coated Copper Foil) |
No
|
Yes
|
Yes
|
| Other: Lead-Free, CAF, Halogen-Free |
Yes
|
Yes
|
Yes
|
Surface Finishes (Thickness) |
Current |
Mid-Term |
Long-Term |
| Immersion Gold ( RoHS/Lead-Free) |
3-5 u inch
|
3-5 u inch
|
3-5 u inch
|
| Immersion Tin ( RoHS/Lead-Free) |
30-60 u inch
|
30-60 u inch
|
30-60 u inch
|
| Immersion Silver ( RoHS/Lead-Free) |
8-14 u inch
|
8-14 u inch
|
8-14 u inch
|
| Lead Free HASL ( RoHS/Lead-Free) |
.0001 – .00015
|
.0001 – .00015
|
N/A
|
| Hot-Air-Solder-Level (HASL) |
.0001 – .00015
|
.0001 – .00015
|
N/A
|
| Electrolytic Soft Gold |
30 u inch
|
30 u inch
|
30 u inch
|
| Electrolytic Hard Gold |
50 u inch
|
50 u inch
|
50 u inch
|
| Gold Tabs |
30-50 u inch
|
30-50 u inch
|
30-50 u inch
|
Soldermask |
Current |
Mid-Term |
Long-Term |
| Minimum Web (Dam) |
.003
|
.002
|
.002
|
| Via Plug – Secondary Screen |
Yes
|
Yes
|
Yes
|
| Soldermask defined features | Yes | Yes | Yes |
Electrical Test |
Current |
Mid-Term |
Long-Term |
| Universal Grid- SMT Dual Sided |
.015 Pitch
|
.015 Pitch
|
.012 Pitch
|
| Flying Probe |
.006 Pitch
|
.006 Pitch
|
.004 Pitch
|
| Non-Contact Tester |
N/A
|
N/A
|
Yes
|
HDI |
Current |
Mid-Term |
Long-Term |
| Sequential Lamination- Mechanical Drill |
.006
|
.006
|
.006
|
| Laser Ablation- Drill Diameter |
.004
|
.004
|
.003
|
| Laser Ablation- Capture Pad Diameter |
.012
|
.010
|
.010
|
| VIA-In-Pad |
Yes
|
Yes
|
Yes
|